E le lingoliloeng tse thusang tsa indasteri tsa indasteri, li-li-tape tse rekisang litaba tsa bohlokoa, li-raditroloctics ka botlalo. Boleng ba eona ba mantlha bo ka ba le bokhoni ba eona bo lokelang ho sebetsoa ka libopeho tse phahameng -}
Ho tloha ka pono ea tekheniki, litšobotsi tsa bohlokoa tsa ho shoa {0 0}}}}}}}}}}}}}}}}}}}}}}}}}}}}}}}}}} Common substrates include PET (polyester film), foam, and non-woven fabric, which are suitable for conductive shielding, cushioning and shock absorption, and lightweight bonding, respectively. Mefuta e fapaneng ea lidhesive e fumaneha, joalo ka acrylics, e fanang ka terata e phahameng ea pele, ha silizone e loketse libaka tse phahameng- Ho nepahala ha Dee {6 {{{{}} Tefo ea sejoale-joale ea laser sce {8 8}
Boemong ba kopo, indasteri ea elektroniki ke 'maraka o moholo ka ho fetisisa oa lefu - Mohlala, ka har'a sefahleho sa bo-'mamefo, ultra - {{3} - - - - Machabeng a likoloi, Flame {{ Mesebetsing ea bongaka, merafo ea "hypoaalbergen silicone e netefatsa hore e lula e le lerootho. Ho makatsang-ntle, mekhoa ea tikoloho e ntse e khanna ntlafatso ea meetso ea metsi-
Nakong e tlang, ka ho ata ha metsoako e metetsang ea likokonyana le lipontšo tse feto-fetohang, li-DE-.<0.03mm) and higher precision. Furthermore, the widespread adoption of digital die-cutting systems will further improve production efficiency, enabling small-batch customized production through CAD/CAM integration. This collaborative evolution of materials and technologies will continue to provide critical support for high-end manufacturing.
